Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® 64
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Intel® VT-x with Extended Page Tables (EPT)
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® Optane™ Memory Supported
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel® Secure Key
Intel® Secure Key includes instructions RDRAND and RDSEED and the underlying the hardware implementation used to generate high-quality keys for cryptographic protocols.
Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.
Intel® Deep Learning Boost (Intel® DL Boost) on CPU
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Intel® Turbo Boost Max Technology 3.0
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Volume Management Device (VMD)
Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.
Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speech-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.
Mode-based Execute Control (MBEC)
Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.
Intel® Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
Intel® Control-Flow Enforcement Technology
CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.
Prekė detaliau
Charakteristikos
- Garantija
- 24
- Category Code
- CPU
- CPU Family name
- Intel Core i3
- Model number
- i3-12100F
- Unit Box Height
- 0.08
- Unit Box Length
- 0.12
- Unit Box Width
- 0.11
- Vendor Homepage
- https://www.intel.com/
- Units per Shipping Box
- 5
- Unit Calculated Weight
- 0.48 kg
- Unit Calculated Volume
- 0.001279 cubm
- Summary
- Intel Core i3-12100F. Processor family: Intel Core i3, Processor socket: LGA 1700, Package type: Box. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Marke
- Logistics data (Harmonized System (HS) code)
- 85423119
- Memory (Memory bandwidth (max))
- 76.8 GB/s
- Processor (Processor boost frequency)
- 4.3 GHz
- Processor (Processor cores)
- 4
- Processor (Processor manufacturer)
- Intel
- Processor (Processor model)
- i3-12100F
- Graphics (Discrete graphics card)
- No
- Graphics (Discrete graphics card model)
- Not available
- Graphics (On-board graphics card)
- No
- Graphics (On-board graphics card model)
- Not available
- Processor (Processor family)
- Intel Core i3
- Processor (Performance cores)
- 4
- Processor (Performance-core boost frequency)
- 4.3 GHz
- Processor (Processor cache)
- 12 MB
- Processor (Processor generation)
- 12th gen Intel Core i3
- Processor (Processor threads)
- 8
- Memory (Memory channels)
- Dual-channel
- Processor (Maximum turbo power)
- 89 W
- Processor (Performance-core base frequency)
- 3.3 GHz
- Processor (Processor base power)
- 58 W
- Processor (Processor cache type)
- Smart Cache
- Processor (Processor socket)
- LGA 1700
- Operational conditions (Maximum operating temperature)
- 100 C
- Processor (Cooler included)
- Yes
- Processor (Package type)
- Box
- Processor (Processor operating modes)
- 64-bit
- Memory (Memory types supported by processor)
- DDR4-SDRAM/DDR5-SDRAM
- Features (Market segment)
- Desktop
- Features (PCI Express slots version)
- 4.0/5.0
- Processor (Maximum number of DMI lanes)
- 8
- Processor (Memory bandwidth supported by processor (max))
- 76.8 GB/s
- Processor (Processor ARK ID)
- 132223
- Processor (Processor codename)
- Alder Lake
- Memory (Maximum internal memory supported by processor)
- 128 GB
- Memory (Non-ECC)
- Yes
- Features (Commodity Classification Automated Tracking System (CCATS))
- G167599
- Features (CPU configuration (max))
- 1
- Features (Direct Media Interface (DMI) Revision)
- 4.0
- Features (Embedded options available)
- No
- Features (Execute Disable Bit)
- Yes
- Features (Export Control Classification Number (ECCN))
- 5A992.C
- Features (Idle States)
- Yes
- Features (Maximum number of PCI Express lanes)
- 20
- Features (PCI Express configurations)
- 1x16+1x4/2x8+1x4
- Features (Scalability)
- 1S
- Features (Supported instruction sets)
- AVX 2.0/SSE4.1/SSE4.2
- Features (Thermal Monitoring Technologies)
- Yes
- Features (Thermal solution specification)
- PCG 2020C
- Features (Use conditions)
- PC/Client/Tablet
- Processor special features (Enhanced Intel SpeedStep Technology)
- Yes
- Processor special features (Intel 64)
- Yes
- Processor special features (Intel Turbo Boost Max Technology 3.0)
- No
- Processor special features (Intel Virtualization Technology (VT-x))
- Yes
- Processor special features (Intel Virtualization Technology for Directed I/O (VT-d))
- Yes
- Processor special features (Intel VT-x with Extended Page Tables (EPT))
- Yes
- Processor special features (Intel AES New Instructions (Intel AES-NI))
- Yes
- Processor special features (Intel Boot Guard)
- Yes
- Processor special features (Intel Control-flow Enforcement Technology (CET))
- Yes
- Processor special features (Intel Deep Learning Boost (Intel DL Boost) on CPU)
- Yes
- Processor special features (Intel Gaussian & Neural Accelerator (Intel GNA) 3.0)
- Yes
- Processor special features (Intel Hyper Threading Technology (Intel HT Technology))
- Yes
- Processor special features (Intel OS Guard)
- Yes
- Processor special features (Intel Secure Key)
- Yes
- Processor special features (Intel Speed Shift Technology)
- Yes
- Processor special features (Intel Standard Manageability (ISM))
- Yes
- Processor special features (Intel Thread Director)
- No
- Processor special features (Intel Turbo Boost Technology)
- 2.0
- Processor special features (Intel Volume Management Device (VMD))
- Yes
- Processor special features (Mode-based Execute Control (MBE))
- Yes
- Operational conditions (Tjunction)
- 100 C
- Technical details (Launch date)
- Q1'22
- Technical details (Status)
- Launched
- Weight & dimensions (Processor package size)
- 45 x 37.5 mm
- Other features (L2 cache)
- 5120 KB
- Other features (Maximum internal memory)
- 128 GB
- Processor (Bus type)
- DMI4
- Processor special features (Intel Enhanced Halt State)
- Yes
- Processor special features (Intel Optane Memory Ready)
- Yes
Greitas palyginimas
Prekė |
CPU|AMD|Desktop|Ryzen 5|5500|Cezanne|3600 MHz|Cores 6|16MB|Socket SAM4|65 Watts|BOX|100-100000457BOX
|
CPU|AMD|Desktop|Ryzen 5|5500|Cezanne|3600 MHz|Cores 6|16MB|Socket SAM4|65 Watts|BOX|100-100000457BOX
|
AMD Ryzen 5 5500, 3.6 GHz, AM4, Processor threads 12, Packing Retail, Processor cores 6, Component for Desktop
|
AMD Ryzen 5 8400F processor 4.2 GHz 16 MB L3 Tray
|
Prieinamumas |
|
|
|
|
Kaina |
94,08 €
|
94,08 €
|
97,09 €
|
101,48 €
|
Aprašymas |
Desktop|Ryzen 5|5500|Cezanne|3600 MHz|Number of cores 6|Cache 16MB|Socket SAM4|Wattage 65 Watts|Turbo frequency 4200 MHz|Packing type BOX|Cooler included | Desktop | AMD Ryzen 5 | 5500 | Cezanne | 3600 MHz | Number of cores 6 | Cache 16MB | Socket SAM4 | Wattage 65 Watts | Turbo frequency 4200 MHz | Packing type BOX | Cooler included | AMD Ryzen 5 5500, 3.6 GHz, AM4, Processor threads 12, Packing Retail, Processor cores 6, Component for Desktop | |
Warranty |
36 month(s) | |||
Net weight |
0.375 kg | |||
Gross weight |
0.45 kg | |||
WEEE tax |
No | |||
Packing quantity |
10 pc(s) | |||
Gross depth master carton |
380 mm | |||
Gross width master carton |
280 mm | |||
Gross height master carton |
160 mm | |||
Net weight master carton |
4.5 kg | |||
Tare weight master carton |
0.289 kg | |||
Volume (m3) |
0.00129276 m | |||
Tare weight (kg) |
0.075 kg | |||
Gross depth (mm) |
133 mm | |||
Gross width (mm) |
135 mm | |||
Gross height (mm) |
72 mm | |||
Paper/Pasteboard |
65 g | |||
Embeeded battery |
No | |||
Plastic (No PET) |
10.00 g | |||
Frequency range |
3.6-4.2 GHz | |||
Memory type |
DDR4 | DDR4 | ||
Component for |
Desktop | |||
Processor family |
AMD | AMD Ryzen™ 5 | ||
Processor socket |
AM4 | Socket AM5 | ||
Processor model |
Ryzen 5 5500 | 8400F | ||
Packing |
Retail | |||
Processor threads |
12 | 12 | ||
Processor frequency |
3.6 GHz | |||
Processor cores |
6 | 6 | ||
Processor boost frequency |
4.7 GHz | |||
Memory types supported by processor |
DDR5-SDRAM | |||
PCI Express slots version |
4.0 | |||
Cooler included |
Yes | Yes | No | |
USB ports quantity |
5 | |||
Thermal Design Power (TDP) |
65 W | |||
Garantija |
36 | 24 | ||
SOCKET |
SAM4 | SAM4 | ||
CACHE |
16MB | 16MB | ||
CLOCK SPEED |
3600 MHz | 3600 MHz | ||
Category Code |
CPU | CPU | ||
CPU Family name |
Ryzen 5 | AMD Ryzen 5 | ||
Frequency speed |
2666/2933/3200 MHz | 2666/2933/3200 MHz | ||
Model number |
5500 | 5500 | ||
Number of cores |
6 | 6 | ||
Packing type |
BOX/BOX | BOX | ||
Turbo frequency |
4200 MHz | 4200 MHz | ||
Unit Box Height |
0.135 | 0.075 | ||
Unit Box Length |
0.14 | 0.137 | ||
Unit Box Width |
0.075 | 0.135 | ||
Unit Net Weight |
0.35 kg | |||
Vendor Homepage |
www.amd.com/en/products/cpu/amd-ryzen-5-5500 | www.amd.com/en/products/cpu/amd-ryzen-5-5500 | ||
Wattage |
65 Watts | 65 Watts | ||
Core name |
Cezanne | Cezanne | ||
CPU application |
Desktop | Desktop | ||
MODEL |
100-100000457BOX | 100-100000457BOX | ||
Memory clock speeds supported by processor |
5200 MHz | |||
Processor cache |
16 MB | |||
Processor lithography |
4 nm | |||
Memory channels |
Dual-channel | |||
Processor manufacturer |
AMD | |||
Configurable TDP-up |
65 W | |||
Processor generation |
AMD Ryzen 8000 Series | |||
Configurable TDP-down |
45 W | |||
Processor cache type |
L3 | |||
On-board graphics card |
No | |||
On-board graphics card model |
Not available | |||
Discrete graphics card model |
Not available | |||
Discrete graphics card |
No | |||
Maximum number of PCI Express lanes |
20 | |||
Processor operating modes |
64-bit | |||
Supported instruction sets |
AVX | |||
Warnings |
Processors contain electronic components that may be harmful to the environment. Do not dispose of in the regular trash. | |||
Units per Shipping Box |
10 | |||
Product Net Weight |
0.35 kg | |||
Unit Calculated Weight |
0.502 kg | |||
Unit Calculated Volume |
0.001417/0.00189 cubm | |||
Market segment |
Desktop | |||
Processor base frequency |
4.2 GHz | |||